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Shenzhen Rison Automation Co., Ltd.  

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首页 > Products > High Speed Full-Automatic PCBA SMT Solder Paste Printer for Ekra/Dek/Mpm/Gkg
High Speed Full-Automatic PCBA SMT Solder Paste Printer for Ekra/Dek/Mpm/Gkg
单价 $10.00 / Piece对比
询价 暂无
浏览 42
发货 Chinaguangdongshenzhen
库存 1000Piece
过期 长期有效
更新 2020-05-16 13:28
 
详细信息
Product Name: High Speed Full-Automatic PCBA SMT Solder Paste Printer for Ekra/Dek/Mpm/Gkg Model NO.: RX-G10 Automation: Automation Certification: ISO, CE Automatic Production Line: Assembly Maximum Print Area: 510mm (X) X 340mm (Y) (Other Sizes Can Be Custo PCB Max Size: 400x300 mm PCB Min Size: 50x50mm Print Speed: 6~200mm/Sec Machine Alignment Capability: >2 Cpk @ +/- 12.5?m, 6 Sigma # Process Alignment Capability: >2 Cpk @ +/- 25?m, 6 Sigma # Core Cycle Time: 7.5 Secs Trademark: RISON Transport Package: Wooden Packing Specification: 1360 x 1180 x 1371 mm Origin: Shenzhen HS Code: 8515190000 Product Description RX-G10 Auto Solder Paste PrinterPRODUCT FEATUREStable stencil positioning structureAutomatic track widthHigh precision work table up/downStencil&PCB vision correctionBoard clamp for warpage PCBEquipped with wiper systemVision teaching,compatible for non-standard fiducialDifferent level user mode256 grey scale threshold vision recognitionFloating squeegee print headProgrammable front&rear print pressure individuallyDry/Vacuum/Wet wiping modeAdjustment jacking platform and Guide Rail positioning SystemStable and easy to adjust, it can quickly adjust the pinjacking height of PCB with different thickness New pattern patented guide rail can detachable, programmable, can automatically stretch out and draw back .Image and optical systemUsing uniform ring light and high brightness coaxial light, with promise brightness adjustment function, then all types of Mark points can be well recognized (Including the rugged Mark points),applicable for tin plating,Cleaning systemThe cleaning system equipped with three cleaning methods: dry cleaning, wet cleaning,vacuum.It can also be cleaned by manual and automatic cleaning to reduce the cleaning time and improve production efficiency.ModelRX-G10Machine Alignment Capability >2 Cpk @ +/- 12.5μm, 6 Sigma #Process Alignment Capability >2 Cpk @ +/- 25μm, 6 Sigma #Core Cycle Time 7.5 secsMaximum Print Area 510mm (X) x 340mm (Y) Printer Construction One piece optimised welded frame Machine Control Motion control using Rison Patented network Operating System Windows embedded 7 Operator Interface Colour TFT touch screen display, keyboard and mouse with Rison software. Machine mountable on either left or right hand side. Camera Digital camera, using IEEE 1394 interface. Multi channel. LED lighting. FOV 8mm x 6mm. Inspection window 48mm2 Camera Positioning Rotary motors and encoders with 4 micron resolution Squeegee Pressure Mechanism Software controlled, motorised Stencil Positioning Pneumatic cylinder clamping Work Table Alignment Motorised via actuators X, Y, and Theta X,Y : 7.5 mm θ±2ºBoard Support Magnetic Support Pin Capable to handle fixture Squeegee Floating double squeegee (1 set included,option:Trailing edge) Stainless Steel Squeegee Blade (Inclination 60º/45º/30º Rubber Squeegee Machine Interface Upline and downline SMEMA included Connectivity RJ-45LAN (networking) and USB2 interface available Tri Colour Beacon Programmable with audible alarm documentation Hard copy manuals comprising: Operator, Installation, Electrical Drawings. Transport SystemSpecificationType Single piece with 3mm Flat transport belts, front rail fixed ESD Compatibility Black transport belts and guides with surface resistivity of greater than 106 ohms Width Adjustment Programmable motorized rear rail Transport Direction Left to right ,Right to left ,Left to left ,Right to right Substrate Handling Size (minimum) 50mm (X) x 50mm (Y)Substrate Handling Size (maximum) 400mm (X) x 300mm (Y)Substrate Thickness 0.2mm to 6mmSubstrate Weight (maximum) 1kgSubstrate Warpage Up to 1% of PCB Diagonal Substrate Fixture Over the top clamps Side Snuggers Vacuum Hold (Option) Substrate Underside Clearance Programmable 3mm to 40mm Process Parameters SpecificationPrint Pressure 0kg to 10kgPrint Speed 6mm/sec to 200mm/secPrint Gap 0mm to 6mmSubstrate Separation Speed: 0.1mm/sec to 2mm/secDistance: 0mm to 2mmPrint ModesPrint / PrintPrint / FloodFlood / PrintPaste Knead Programmable: number; period; on demand Vision SpecificationFiducial Recognition Automatic fiducial teach and find incorporating 0.1mm fiducial capture Fiducials 2 or 3Fiducial Types Synthetic fiducial library or unique pattern recognition Fiducial Size 0.1mm to 3mmFiducial Locations Anywhere on substrate Fiducial Error Recovery Auto lighting adjustmentAuto fiducial search Camera Lighting Software controlled programmable LED lighting ChaseSpecificationScreen frame Size (maximum) 736mm x 736mm (29" x 29")Screen frame Size (minimum) 370mm x 470mmScreen frame Thickness 25mm to 38mm (1" to 1.5")Image PositionFrontCentreCustomStencil WipeSpecificationOperation Mode Programmable Wet/Vacuum/Dry Solvent Pump AutoVacuum Zic-Zac Feature Option:Left & Right Zic-ZacOperating EnvironmentSpecificationTemperature10° to 35° C (50° to 95° F)Humidity30% to 70% relative humidity (non-condensing) 30% to 70%ServicesSpecificationVoltage AC 220 Volts +/- 10%. Single phase 50/60Hz,3Kw Maximum Current at 220V10 Amps with vacuum pump3 Amps without vacuum pumpOver Current Protection An external circuit breaker ≤ 25 Amps is required to be fitted in line with the machine supply Air SupplyTo ISO 8573.1 Standard Quality Class 2.3.3 Pressure 5 bar to 7 barGeneral usage 5 litres/minute at 5 bar to 7 bar Process Height 890mm ±30mmMachine Dimension 1360 x 1180 x 1371 mm (Excluding Monitor & Light Tower)Machine Weight Approx 1000 Kg